GF1A Datasheet, PDF (1/2 Pages) General Semiconductor – SURFACE MOUNT GLASS PASSIVATED JUNCTION RECTIFIER

SURFACE MOUNT GLASS PASSIVATED JUNCTION RECTIFIER
FEATURES
l _{Plastic package has Underwriters Laboratory}
l Flammability Classification 94V-0
l Ideal for surface mount automotive applications
l High temperature metallurgically bonded construction
l ^{Glass passivated cavity-free junction}
l High temperature soldering guaranteed: 450°C/5 seconds
l ^{at terminals}
l _{Complete device submersible temperature of 265°C for}
l 10 seconds in solder bath
GF1A THRU GF1M
50V-1000V 1.0A
MECHANICAL DATA
Case: JEDEC DO-214BA molded plastic over glass body
Terminals: Solder plated, solderable per MIL-STD-750,
Method 2026
Polarity: Color band denotes cathode end
Mounting Position: Any
Weight: 0.0048 ounces, 0.120 gram
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified.
Device marking code
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
at TL=125°C
Peak forward surge current
8.3ms single half sine-wave superimposed on
rated load (JEDEC Method)
Maximum instantaneous forward voltage at 1.0A
Maximum DC reverse current
at rated DC blocking voltage
TA=25°C
TA=125°C
Typical reverse recovery time (NOTE 1)
Typical junction capacitance (NOTE 2)
Typical thermal resistance (NOTE 3)
Operating junction and storage temperature range
SYMBOLS
VRRM
VRMS
VDC
I(AV)
IFSM
VF
IR
trr
CJ
RΘJA
RΘJL
TJ, TSTG
NOTES:
(1) Reverse recovery test conditions: IF=0.5A, IR=1.0A, Irr=0.25A
(2) Measured at 1.0 MHz and applied VR=4.0 Volts
(3) Thermal resistance from junction to ambient and from junction to lead
P.C.B. mounted on 0.2 x 0.2” (5.0 x 5.0mm) copper pad areas
GF1A
GA
50
35
50
GF1B
GB
100
70
100
GF1D
GD
200
140
200
GF1G
GG
400
280
400
1.0
GF1J
GJ
600
420
600
30.0
1.10
5.0
50.0
2.0
15.0
80.0
26.0
-65 to +175
GF1K
GK
800
560
800
GF1M
GM
1000
700
1000
UNITS
Volts
Volts
Volts
Amp
Amps
1.20
Volts
µA
µs
pF
°C/W
°C
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