BY448 Datasheet, PDF (1/2 Pages) NXP Semiconductors – Damper diode

Miniature Clamper/Damper Glass Passivated Rectifier
FEATURES
• Superectifier structure for high reliability
application
• Cavity-free glass-passivated junction
• Low forward voltage drop
• Typical I_R less than 0.1 μA
• High forward surge capability
• Meets environmental standard MIL-S-19500
• Solder dip 275 °C max. 10 s, per JESD 22-B106
• AEC-Q101 qualified
• Compliant to RoHS Directive 2002/95/EC and in
accordance to WEEE 2002/96/EC
MECHANICAL DATA
Terminal:Plated axial leads solderable per
MIL-STD 202E, method 208C
Case:Molded with UL-94 Class V-0 recognized Flame
Retardant Epoxy
Polarity:color band denotes cathode
Mounting position:any
BY448GP
1650V 1.5A
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
SYMBOL
BY448GP
units
Maximum Recurrent Peak Reverse Voltage
Vrrm
1650
V
Maximum RMS Voltage
Vrms
1150
V
Maximum DC blocking Voltage
Vdc
1650
V
Maximum Average Forward Rectified
If(av)
2.0
Current 3/8”lead length at Ta =55°C
A
Peak Forward Surge Current 8.3ms single
Ifsm
30.0
Half sine-wave superimposed on rated load
A
Maximum Instantaneous Forward Voltage
Vf
1.60
at 3.0A
V
Maximum full load reverse current full cycle
Ir(av)
Average at 55°C
100.0
µA
Maximum DC Reverse Current
Ta =25°C
Ir
5.0
µA
at rated DC blocking voltage
Ta =150°C
150.0
µA
Typical Reverse Recovery Time
(Note 1)
Trr
1000
nS
Typical Thermal Resistance
(Note 2)
Rth(ja)
100
K/W
Storage and Operating Junction Temperature
Tstg, Tj
-65 to +175
°C
Note:
1. Reverse Recovery Condition If =0.5A, Ir =1.0A, Irr =0.25A
2. Thermal Resistance from Junction to Ambient on PC board with spacing 25mm
E-mail: [e-mail]
1 of 2
Web Site: www.taychipst.com