TIL311 Datasheet, PDF (6/8 Pages) Texas Instruments – HEXDECIMAL DISPLAY WITH LOGIC

TIL311
HEXADECIMAL DISPLAY WITH LOGIC
TAOS058 − JANUARY 2004
MECHANICAL DATA
These assemblies consist of LED chips and a TTL MSI logic chip mounted on a header with a red molded plastic body.
Multiple displays may be mounted on 0.450-inch (11,43-mm) centers.
PACKAGE P
PLASTIC DUAL-IN-LINE
END VIEW
Seating Plane
0.170 (4,32) MIN
0.140 (3,60)
0.110 (2,80)
0.022 (0,56)
DIA All Pins
0.018 (0,46)
TOP VIEW
CL OF PIN 1
0.420 (10,67)
0.380 (9,65)
0.010 (0,25) NOM
4 Sides
0.070 (1,78)
CL OF PIN 1
0.150 (3,80)
5°
0.270 (6,90)
0.170 (4,30)
0.160 (4,10)
Logic
Chip
0.015 (0,38)
0.160 (4,10)
BOTTOM VIEW
0.075 (1,91) MAX
14
0.086 (2,16)
MAX
13
0.760 (19,31)
12
0.720 (18,29)
10
8
0.300 (7,62)
0.010 (0,26)
0.075 (1,91) MAX
1
2
3
0.022 (0,56)
0.018 (0,46)
4
DIA All Pins
5
0.100 (2,54) TP
12 Places
(See Note B)
7
0.085 (2,16) MAX
NOTES: A. All linear dimensions are in inches and (parenthetically) in millimeters.
B. The true-position pin spacing is 0.100 (2,54) between centerlines. Each centerline is located within 0.010 ( 0,26) of its true
longitudinal position relative to pins 1 and 14.
C. Associated centerlines of character segments and decimal point dimensions are nominal.
D. This drawing is subject to change without notice.
Figure 5. Package P — Plastic Dual-In-Line Packaging Configuration
Copyright E 2006, TAOS Inc.
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