TL1454A_14 Datasheet, PDF (3/25 Pages) Texas Instruments – DUAL-CHANNEL PULSE-WIDTH-MODULATION (PWM) CONTROL CIRCUIT

TL1454A, TL1454AY
DUALĆCHANNEL PULSEĆWIDTHĆMODULATION (PWM)
CONTROL CIRCUIT
SLVS423 A− MAY 2002 − REVISED SEPTEMBER 2002
TL1454AY chip information
This device, when properly assembled, displays characteristics similar to the TL1454AC. Thermal compression
or ultrasonic bonding may be used on the doped aluminum bonding pads. The chips may be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
(15)
(14)
(13) (12)
(11)
(10)
(9)
(16)
86
(1)
(8)
(2)
(3)
(4) (5)
(6)
(7)
108
CT ⁽¹⁾
(2)
RT
(3)
DTC1
(4)
IN1 +
(5)
IN1−
COMP1 ⁽⁶⁾
(7)
GND
(8)
OUT1
TL1454AY
(16) _REF
(15)
SCP
(14)
DTC2
(13)
IN2+
(12)
IN2 −
(11) _COMP2
(10)
VCC
(9)
OUT2
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4 × 4 MINIMUM
TJmax = 150°C
TOLERANCES ARE ± 10%.
ALL DIMENSIONS ARE IN MILS.
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