TCS230 Datasheet, PDF (10/12 Pages) List of Unclassifed Manufacturers – PROGRAMMABLE COLOR LIGHTTOFREQUENCY CONVERTER

TCS230
PROGRAMMABLE
COLOR LIGHT-TO-FREQUENCY CONVERTER
TAOS046M − OCTOBER 2007
MANUFACTURING INFORMATION
The Plastic Small Outline IC package (D) has been tested and has demonstrated an ability to be reflow soldered
to a PCB substrate.
The solder reflow profile describes the expected maximum heat exposure of components during the solder
reflow process of product on a PCB. Temperature is measured on top of component. The component should
be limited to a maximum of three passes through this solder reflow profile.
Table 2. TCS230 Solder Reflow Profile
PARAMETER
Average temperature gradient in preheating
Soak time
Time above 217°C
Time above 230°C
Time above T_peak −10°C
Peak temperature in reflow
Temperature gradient in cooling
REFERENCE
t_soak
t₁
t₂
t₃
T_peak
TCS230
2.5°C/sec
2 to 3 minutes
Max 60 sec
Max 50 sec
Max 10 sec
260° C (−0°C/+5°C)
Max −5°C/sec
T_peak
T₃
T₂
T₁
Not to scale — for reference only
Time (sec)
t₃
t₂
t_soak
t₁
Figure 7. TCS230 Solder Reflow Profile Graph
Copyright E 2007, TAOS Inc.
10
r
www.taosinc.com
The LUMENOLOGY r Company
r