LA02 Datasheet, PDF (20/20 Pages) Taoglas antenna solutions – 2.4GHz Embedded Loop Chip Antenna

8. Recommended Reflow Temp Profile
Phase
PREHEAT
RAMP-UP
Profile features
Pb-Free Assembly
(SnAgCu)
-Temperature Min(Tsmin)
-Temperature Max(Tsmax)
-Time(ts) form (Tsmin to
Tsmax)
150℃
200℃
60-120 seconds
Avg. Ramp-up Rate (Tsmax
3℃/second(max)
to TP)
REFLOW
-Temperature(TL)
-Total Time above TL (t L)
217℃
30-100 seconds
PEAK
-Temperature(TP)
-Time(tp)
RAMP-DOWN Rate
Time from 25℃ to Peak Temperature
Composition of solder paste
Solder Paste Model
260℃
5-10 second
6℃ / second max.
8 minutes max.
96.5Sn/3Ag/0.5Cu
SHENMAO PF606-P26
SPE-15-8-040/B/WY
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