PA.25A Datasheet, PDF (19/20 Pages) Taoglas antenna solutions – High Efficiency Multi-Band SMD Antenna

7. Recommended Reflow Temperature Profile
The PA.25 can be assembled following either Sn-Pb or Pb-Free assembly processes. The
recommended soldering temperatures are as follows:
Phase
Profile Features
Pb-Free Assembly
Sn-Pb Assembly
(SnAgCu)
Ramp-Up
Avg Ramp-Up Rate (Tsmax to Tp)
Preheat
Temperature Min (Tsmin)
Temperature Max (Tsmax)
Time (tsmin to tsmax)
Reflow
Temperature (TL)
Total Time Above TL b(tL)
Peak
Temperature (Tp)
Time (tp)
Ramp-Down Rate
Time from 25°C to peak Temperature
3°C/second (max)
100°
150°
60-120 seconds
183°C
60-150 seconds
235°C
10-30 seconds
6°C/second (max)
6 minutes max
3°C/second (max)
150°
200°
60-180 seconds
217°C
60-150 seconds
260°C
20-40 seconds
6°C/second (max)
8 minutes max
Tp
TL
Tsmax
Tsmin
Ramp-up
tp
tL
Critical Zone TL to Tp
ts Preheat
Ramp-down
25°
t 25°C to Peak
Time
Temperature profile – (green area) for the assembly process in reflow ovens
SPE-11-8-061/I Page 19 of 20