SGP.1575.18.4.C.02 Datasheet, PDF (11/12 Pages) Taoglas antenna solutions – patent pending

5. Recommended Reflow Soldering Profile
SGP.18C can be assembled following Pb-free assembly. According to the Standard
IPC/JEDEC J-STD-020C, the temperature profile suggested is as follow:
Phase
Profile Features
Pb-Free Assembly (SnAgCu)
PREHEAT
Temperature Min(Tsmin)
150°C
Temperature Max(Tsmax)
200°C
Time(ts) from (Tsmin to Tsmax) 60-120 seconds
RAMP-UP
Avg. Ramp-up Rate (Tsmax to TP) 3°C/second(max)
REFLOW
Temperature(TL)
217°C
Total Time above TL (tL)
30-100 seconds
PEAK
Temperature(TP)
260°C
Time(tp)
2-5 seconds
RAMP-DOWN Rate
3°C/second(max)
Time from 25°C to Peak Temperature
8 minutes max.
Composition of solder paste
96.5Sn/3Ag/0.5Cu
Solder Paste Model
SHENMAO PF606-P26
Soldering Iron condition: Soldering iron temperature 270°C±10°C.
Apply preheating at 120°C for 2-3 minutes. Finish soldering for each terminal within 3 seconds, if soldering iron
temperature over270°C±10°C or 3 seconds, it will make cause component surface peeling or damage.
SPE-11-8-138/E/SS Page 11 of 12