SGP.1575.15.4.A.02 Datasheet, PDF (11/12 Pages) Taoglas antenna solutions – Patent Pending

5. Recommended Reflow Soldering Profile
SGP.15A can be assembled following Pb-free assembly. According to the Standard IPC/JEDEC J-STD-
020C, the temperature profile suggested is as follow:
Phase
Profile Features
PREHEAT
Temperature Min(Tsmin)
Temperature Max(Tsmax)
Time(ts) from (Tsmin to Tsmax)
RAMP-UP
Avg. Ramp-up Rate (Tsmax to TP)
REFLOW
Temperature(TL)
Total Time above TL (tL)
PEAK
Temperature(TP)
Time(tp)
RAMP-DOWN
Rate
Time from 25°C to Peak Temperature
Composition of solder paste
Solder Paste Model
Pb-Free Assembly (SnAgCu)
150°C
200°C
60-120 seconds
3°C/second(max)
217°C
30-100 seconds
260°C
2-5 seconds
3°C/second(max)
8 minutes max.
96.5Sn/3Ag/0.5Cu
SHENMAO PF606-P26
Soldering Iron condition: Soldering iron temperature 270°C±10°C.
Apply preheating at 120°C for 2-3 minutes. Finish soldering for each terminal within 3 seconds, if soldering
iron temperature over 270°C±10°C or 3 seconds, it will make cause component surface peeling or damage.
SPE-11-8-137/E/SS | page 11 of 12