LAL03TB470K Datasheet, PDF (19/23 Pages) Taiyo Yuden (U.S.A.), Inc – AXIAL LEADED INDUCTORS

RELIABILITY DATAɹ
6/9
Specified Value
Item
LA02 Type/
LA03 Type
LA04 Type
LA05 Type
LHL˘˘˘/
LHF15BB/
LHFP˘˘BB
FBA/FBR
LAV35
FL05˘
Type
FL06BT
Type
Test Method and Remarks
21.Resisitance to soldering No significant abnormality ˚L/LD
No signifi- No signifi- ˚L/LD
Refer to No signifi- LAD
heat
in appearance
Within M5L cant abnor- cant abnor- WithinM5L i n d i v i d u a l cant abnor- Solder temperatureD260M5CfLA02g
QD15min. mality in ap- mality in ap- QD30min. specifica- mality in ap-
270M5CfLA03YLA04YLA05g
pearance pearance
tion
pearance DurationD5M0.5 sec.ɹOne time
Inductance Impedance
Impedance Immersed conditionsDInserted into substrate with̓= 1.6mm
changeD changeD
WithinM5L WithinM20L
changeɿ RecoveryDAt least 1hr of recovery under the standard
WithinM20L
condition after the test, followed by the mea-
5
Q changeD
surement within 2hrs.
WithinM30L
LHLYLHFYLHFPD
Solder bath method
Solder temperatureD260M5C
DurationD10M1 sec.
DUp to 1.5mm from bottom of kinked part.
[LHL06, LHLC06, LHLZ06]
DUp to 1.5mm from bottom of case.
[LHL08, LHL10, LHL13, LHL16]
DUp to 1.5mm from bottom of base.
[LHF15BB, LHFP˘˘BB]
Manual soldering
Solder temperatureD350M10CfAt the tip of soldering irong
DurationD5M1 sec.
DUp to 1.5mm from bottom of kinked part.
[LHL06, LHLC06, LHLZ06]
DUp to 1.5mm from bottom of case.
[LHL08, LHL10, LHL13, LHL16]
DUp to 1.5mm from bottom of base.
[LHF15BB, LHFP˘˘BB]
CautionDNo excessive pressing shall be applied to terminald
RecoveryD4 to 24hrs of recovery under the standard con-
dition after the tset.
FBD
Solder bath method
Condition 1
Solder temperatureD260M5C
DurationD10M1 sec.
Immersion depthDUp to 1.5mm from terminal root.
Condition 2
Solder temperatureD350M5C
DurationD3M1 sec.
Immersion depthDUp to 1.5mm from terminal root.
RecoveryD3hrs of recovery under the standard condition
after the test.
LAV35D
Solder temperatureD260M5C
DurationD5M0.5 sec.
Immersion depthDUp to 2.0 to 2.5mm from botoom of
kinked part.
RecoveryD4 to 24hrs of recovery under the standard con-
dition after the tset.
FLD
Solder conditionD260M5Cɹ10M1 sec.
Immersion depthDUp to 0.5 to 1.0mm from terminal root.
RecoveryD3hrs of recovery under the standard condition
after the test.
347