FBMJ2125HS420 Datasheet, PDF(14/15 Page) Taiyo Yuden (U.S.A.), Inc – CHIP BEAD INDUCTORS FOR POWER LINES (FB SERIES M TYPE)

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FBMJ2125HS420 Datasheet, PDF (14/15 Pages) Taiyo Yuden (U.S.A.), Inc – CHIP BEAD INDUCTORS FOR POWER LINES (FB SERIES M TYPE)

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CHIP BEAD INDUCTORS FOR POWER LINE ï¼FB SERIES M TYPEï¼

â PRECAUTIONS

1. Circuit Design

Precautions

âOperating environment

1. The products described in this specification are intended for use in general electronic equipment, (office supply equipment,

telecommunications systems, measuring equipment, and household equipment). They are not intended for use in mission-critical

equipment or systems requiring special quality and high reliability (traffic systems, safety equipment, aerospace systems, nuclear

control systems and medical equipment including life-support systems,) where product failure might result in loss of life, injury or

damage. For such uses, contact TAIYO YUDEN Sales Department in advance.

âRated current

1. Rated current of this product is shown in this catalogue, but please be sure to have the base board designed with adequate inspection in

case of the generation of heat becomes high within the rated current range when the base board is in high resistance or in bad heating

conditions.

2. PCB Design

Precautions

âLand pattern design

1. Please refer to a recommended land pattern.

3. Considerations for automatic placement

Precautions

âAdjustment of mounting machine

1. Excessive impact load should not be imposed on the products when mounting onto the PC boards.

2. Mounting and soldering conditions should be checked beforehand.

Technical âAdjustment of mounting machine

considerations 1. When installing products, care should be taken not to apply distortion stress as it may deform the products.

4. Soldering

Precautions

âWave soldering

1. Please refer to the specifications in the catalog for a wave soldering.

âReflow soldering

1. Please contact any of our offices for a reflow soldering, and refer to the recommended condition specified.

âLead free soldering

1. When using products with lead free soldering, we request to use them after confirming adhesion, temperature of resistance to soldering

heat, etc. sufficiently.

âPreheating when soldering

Heating : The temperature difference between soldering and remaining heat should not be greater than 150â.

Cooling : The temperature difference between the components and cleaning process should not be greater than 100â.

âRecommended conditions for using a soldering iron

Put the soldering iron on the land-pattern.

Soldering iron's temperature - Below 350â

Duration - 3 seconds or less

The soldering iron should not directly touch the inductor.

âWave, Reflow, Lead free soldering

1. If products are used beyond the range of the recommended conditions, heat stresses may deform the products, and consequently

degrade the reliability of the products.

ãRecommended reflow conditionã

Technical

considerations

âPreheating when soldering

1. There is a case that products get damaged by a heat shock.

âRecommended conditions for using a soldering iron

1. If products are used beyond the range of the recommended conditions, heat stresses may deform the products, and consequently

degrade the reliability of the products.

â¶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

chipbeads_prec_e-E02R01

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