EYMF2CAMM Datasheet, PDF (13/14 Pages) Taiyo Yuden (U.S.A.), Inc – Buletooth Module

TAIYO YUDEN
Aug./2004 Ver.1.0
Bluetooth^® Module
Class1 UART Full Module
EYSF1UA**, EYSF1UA**-**
Features
•The module is a Max.20dBm( Class1 ) module.
Outline
•Bluetooth^® standard Ver1.2(Mandatory) conformity.
( Ready for Optional Ver1.2 features )
34-+00.3.3
•Internal baseband clock oscillator.
•Support functions
SCO links,ACL links,Piconet<7>,Hold,Sniff,Park,
3.5
1.5X5
6
16
1.5X9
Power Control
•Interface:UART,PCM,GPIO
•Protocol stack:
Under HCI firmware Type,
GAP+SDP+SPP+DUN+FAX+OPP+GOEP+HSP,
A2DP+AVRCP+AVDTP+GAVDP+AVCTP+(HSP),
HCRP+BIP +OPP+GOEP Stacked Type , etc
17
•Small outline. 34.0 x 15.6 x 2.4 mm
• RoHS regulation substance (Pb.Cd.Hg.Cr+6.PBB.PBDE) :
Non use
Applications
•PC peripheral equipment
•Home Network , AV
•Access Point , FA etc
General Electrical Specification
Parameter
Description
Carrier Frequency
Y _{Operating Voltage (VDD_PA)}
Operating Voltage (VDD)
R _{RF Output Power}
measured in 50 ohm,VDD_PA=VDD=3.3V
RX Sensitivity
A _{Load Impedance}
No abnormal Oscillation
Input Low Voltage
IN ^{Input High Voltage}
Output Low Voltage
Output High Voltage
UART,PCM,GPIO
IM ^{Peak Current}
Continues TX, ,VDD=3.3V
Audio with HV3 ,VDD=3.3V ,
Average Current Consumption 1
TX=Max Power, Slave
L Average Current Consumption 2 Send ,(Master) DH5 packet , 921.6kbps,HCI,
Average Current Consumption 3 Receive, (Slave) _{TX=Max Power,VDD=3.3V}
E _{Average Current Consumption 4 Deep Sleep ,VDD=3.3V}
General Operating temperature condition
PR ^{Block Diagram}
Min.
2.402
3.2
3.2
Typ.
3.3
+17
-81
-
-
0.8VDD -
-
VDD-0.6 -
135
43
95
56
0.9
-20
Unit;mm
3.5
1
32
Max. Units
2.480 GHz
3.4
V
VDD_PA V
+20 dBm
-70 dBm
5:1
-
0.2VDD V
-
V
0.4
V
-
V
180 mA
mA
mA
mA
mA
+70 deg-C
SW
L.P.F
B.P.F MATCHING
PA MATCHING
RADIO
CRYSTAL
32MHz
BB
ROM / RAM
ARM7 TDMI
JTAG
PCM UART GPIO
VOLTAGE
REGULATOR
FLASH
ROM
VOLTAGE
REGULATOR
CRYSTAL
32 kHz
VDD
RESET
GND
JTAG (5)
VDD_PA
PCM (4) UART (4) GPIO (4)
Note: The above PRELIMINARY data are not guaranteed and are subject to change without notice.
The Bluetooth^® word mark and logos are owned by the Bluetooth SIG, Inc. and any use of such marks by TAIYO YUDEN CO., LTD. is under license.