TX0315A Datasheet, PDF (7/7 Pages) TAI-SAW TECHNOLOGY CO., LTD. – VCTCXO SMD 3.2x2.5 26.000MHz

Notes of the Usage:
1. Touch the solder iron at 260+/-5 deg C onto the leads for 10+/-2 sec max or touch the
solder at 350+/-5 deg C onto the leads for 3+/-0.5 sec.
2. In the customer’s reflow process, if it will remain some mechanical stress at the soldering
terminals, also make some cracks on the soldering termination. Some cracks will cause
open or short circuit and cause of thermal increasing or smoking. Don’t make any excess
mechanical stress to soldering points.
3. In case of giving a heavy shock to the products, it may make an open or short circuit and
cause of thermal increasing and smoking. To avoid heavy shock impact applying to
products is strictly required.
Notes of the Storage:
1. To keep products under the condition at the room temperature (-5~35 deg C) with normal
humidity (45~75%). Absorption of moisture and dewdrop may make inferiority of
characteristics and a short circuit.
2. Oxidization of terminals shall make the solderability more inferior. Dusts and corrosive gas
will make a cause of the open or short circuit. Keep it in the clean place where is not in
dusty and no corrosive gas.
3. Use the unti-static material to the storage package.
4. Don’t put any excess weight to the VCTCXO in the storage process.
5. Don’t move the product from the cold place to the hot place in the short time, otherwise it
may make some dew-drop, then a short circuit may happen in case.
6. Storage periods should be maximum 6 months under condition of above item 1 after
delivery from TST factory.
7. Once open the bag, there is possibility of electrical characteristics deterioration due to
absorption of moisture. So, please use parts within 7 days after opening the bag.
8. If you have to keep parts without using after opening the bag, please put the drying agent
in the bag, fold the bag and keep it in the place where temperature and humidity are
controlled (nitrogen atmosphere box etc.)
TAI-SAW TECHNOLOGY CO., LTD.
TST DCC
7
Release document