NQ10W50PKA07 Datasheet, PDF (12/14 Pages) SynQor Worldwide Headquarters – SMT Surface Mount Package

Technical Specification
Input: 10.2 - 13.2V
Outputs: 0.7 - 5.0V
Current: 7A
Package: SMT
VADJ and CTRL GND pins. The R₁ connection should be between
the pin and the point where the CTRL GND and PWR GND nodes
meet. In cases where the output voltage is not trimmed above the
reference voltage (R₂ < 50 W), it should be noted that the trim con-
nection would be substantially used for high-frequency feedback
as well as DC sensing, so the feedback loop would see any fil-
tering network including parasitic inductance between the output
pins and the remote sense point.
RoHS Compliance: The EU led RoHS (Restriction of Hazardous
Substances) Directive bans the use of Lead, Cadmium, Hexavalent
Chromium, Mercury, Polybrominated Biphenyls (PBB), and
Polybrominated Diphenyl Ether (PBDE) in Electrical and Electronic
Equipment. This SynQor product is available as 6/6 RoHS com-
pliant. For more information please refer to SynQor’s RoHS
addendum available at our RoHS Compliance / Lead Free
Initiative web page or e-mail us at [e-mail].
When using the remote sensing to compensate for a substantial
voltage drop on the VOUT rail between converter and load (i.e.,
more than 1% of output voltage), the load voltage accuracy can
be impacted by the internal 100K resistor between the VOUT and
VADJ pins, especially at higher output voltage trim settings, where
the trimming resistor R₂ connected to the remote sense load starts
to become a significant fraction of the 100K resistor. The follow-
ing equation for the load voltage adjusts for this effect:
V_load = V_{ref *} [1 + (R₂ || 100K) / R₁] - V_{drop *} [R₂ / (R₂ + 100K)]
Where Vdrop is the difference between the output voltage at the
converter pin and the load voltage (both measured with respect
to the CTRL GND pin.)
Internal vs External Reference: The QS1 version uses an
internal reference to maintain 0.7V at the VADJ pin during normal
steady-state operating conditions. The QS4 also uses an internal
reference, but maintains 0.6V at the VADJ pin. The QS2 and the
QS3 are configured to use an external reference voltage applied
at the VSET pin. The converter will maintain this voltage, which
may be between 0.7V and 1.0V, at the VADJ pin during normal
steady-state operating conditions. Under no conditions should the
VSET pin be driven above the absolute maximum voltage of 2.7V.
Margining: With the QS1 and QS4 versions, the converter out-
put voltage can be margined up or down by 5% by applying a
logic-high voltage to the TRIMP and TRIMN pins. The table below
summarizes the margining operation. There is an internal 50K
resistor to ground at each of these pins. The logic threshold is
about 1.4V, and the pins should be driven no higher than 5V.
When using the QS2 or QS3 versions, the TRIMP and TRIMN pins
should be connected to the CTRL GND pin.
TRIMP pin
Low/Open
High
Low/Open
High
TRIMN pin
Low/Open
Low/Open
High
High
Mode
No Margining
+5%
-5%
No Margining
SURFACE MOUNT INFORMATION
PCB Layout Considerations: SynQor recommends that the
customer use a non-solder mask defined pad design. The mini-
mum recommended pad size is 0.074" x 0.122" (1.88mm x
3.1mm) and the maximum pad size is 0.095" x 0.140" (2.41mm
x 3.56mm), see the mechanical diagram on page 2.
Interconnection to internal power planes is typically required.
This can be accomplished by placing a number of vias between
the SMT pad and the relevant plane. The number and location of
the vias should be determined based on electrical resistance, cur-
rent and thermal requirements. "Via-in-pad" design should be
avoided in the SMT pads. Solder mask should be used to elimi-
nate solder wicking into the vias.
Pick and Place: The NiQor surface mount modules are
designed for automated assembly using standard SMT pick and
place equipment. The modules have a centrally located inductor
component with a flat surface area to be used for component
pick-up. The units use open frame construction and have a low
mass that is within the capability of standard pick and place
equipment. Those modules however have a larger mass than
most conventional SMT components and so variables such as noz-
zle size, tip style, handling speed, and placement pressure should
be optimized for best results. A conformal tipped placement noz-
zle design is recommended. Coplanarity of better than 0.004"
(0.1mm) is achieved through the SMT NiQor's terminal design.
Reflow Soldering Guidelines: Figure J shows a typical
reflow profile for a eutectic solder process. Due to variations in
customer applications, materials and processes, it is not feasible
for SynQor to recommend a specific reflow profile. The customer
should use this profile as a guideline only. Since the NiQor sur-
face mount modules have a larger thermal mass and lower ther-
mal resistance than standard SMT components, it may be neces-
sary to optimize the solder reflow profile based on limitations of
the other components on the customer board. Sufficient reflow
time must be allowed to fuse the plating on the connection to
ensure a reliable solder joint. The solder reflow profile should be
confirmed by accurately measuring the SMT interconnect leads.
The guidelines illustrated in Figure J must be observed to ensure
the maximum case temperature of 260°C (exposure for 5 seconds
or less) is not exceeded for the NiQor units.
Product # NQ10W50PKA07
Phone [phone]
www.synqor.com
Doc.# 005-2NS2T5N Rev. B 6/12/07
Page 12