W4F300-RD-10 Datasheet, PDF (7/9 Pages) Superworld Electronics – WIREWOUND TYPE COMMON MODE FILTER

WIREWOUND TYPE COMMON MODE FILTER
W4 SERIES
9. SOLDERING AND MOUNTING :
9-1. Recommended PC Board Pattern
1
2
4
3
1.90
3.70
PC board should be designed so that products are not sufficient
under mechanical stress as warping the board.
Products shall be positioned in the sideway direction against
the mechanical stress to prevent failure.
9-2. Soldering
Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused
by the difference in coefficients of expansion between solder, chip and substrate. Our terminations are suitable for all
wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot
air soldering tools.
9-2.1 Solder Re-flow :
Recommended temperature profiles for re-flow soldering in Figure 1.
9-2.2 Solder Wave :
Wave soldering is perhaps the most rigorous of surface mount soldering processes due to the steep rise in temperature
seen by the circuit when immersed in the molten solder wave, typical at 240°C. Due to the risk of thermal damage to
products, wave soldering of large size products is discouraged. Recommended temperature profile for wave soldering
is shown in Figure 2.
9-2.3 Soldering Iron (Figure 3) :
Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that
a soldering iron must be employed the following precautions are recommended.
Note :
a) Preheat circuit and products to 150°C.
b) 280°C tip temperature (max)
c) Never contact the ceramic with the iron tip
d) 1.0mm tip diameter (max)
e) Use a 20 watt soldering iron with tip diameter of 1.0mm
f) Limit soldering time to 3 secs.
Preheating Soldering
230
(446)
150
(302)
Natural
cooling
Preheating Soldering
250
230
150
Natural
cooling
Over
1min.
Over
1min.
Gradual Cooling
Within 10secs.
Figure 1. Re-flow Soldering
Preheating
280
230
150
Soldering
Natural
cooling
Over 2mins.
Gradual Cooling
Within 3secs.
Figure 2. Wave Soldering
Over 1min.
Gradual Cooling
Within 3secs.
Figure 3. Hand Soldering
NOTE : Specifications subject to change without notice. Please check our website for latest information.
17.06.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 7