SPS201610HR47YF Datasheet, PDF (7/9 Pages) Superworld Electronics – SMD POWER INDUCTOR

SMD POWER INDUCTOR
8. SOLDERING AND MOUNTING :
8-1. Recommended PC Board Pattern
2.4
SPS201610H SERIES
0.8
9-2. Soldering
Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused
by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all
wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot
air soldering tools.
9-2.1 Lead Free Solder Re-flow :
Recommended temperature profiles for re-flow soldering in Figure 1.
9-2.2 Soldering Iron (Figure 2) :
Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that
a soldering iron must be employed the following precautions are recommended.
Note :
a) Preheat circuit and products to 150°C.
d) 1.0mm tip diameter (max)
b) 355°C tip temperature (max)
e) Use a 20 watt soldering iron with tip diameter of 1.0mm
c) Never contact the ceramic with the iron tip
f) Limit soldering time to 4-5 secs.
P rehe ating
TP(26 0°C/40 s max.)
S olde ring
20~40s
Natu ral
cooling
217
200
150
60~150s
60~180s
4 80s max.
25
Time(sec.)
Reflow times: 3 times Max.
Fig.1
P rehe ating
350
S olde ring
w ithin 4-5s
Natu ral
cooling
150
O ver 60s
G rad ual
Cooling
Time(sec.)
Iron Soldering times: 1 times Max.
Fig.2
NOTE : Specifications subject to change without notice. Please check our website for latest information.
15.08.2013
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 7