Z0B100-RB-10 Datasheet, PDF (6/9 Pages) Superworld Electronics – FERRITE CHIP BEADS

FERRITE CHIP BEADS
Z0 SERIES
8. SOLDERING AND MOUNTING :
8-1. Recommended PC Board Pattern
0.80
0.30
PC board should be designed so that products can prevent damage from
mechanical stress when warping the board.
8-2. Soldering
Mildly activated rosin fluxes are preferred. The terminations are suitable for re-flow soldering systems. If hand soldering
cannot be avoided, the preferred technique is the utilization of hot air soldering tools.
Note.
If wave soldering is used ,there will be some risk.
Re-flow soldering temperatures below 240 degrees, there will be non-wetting risk
8-2.1 Lead Free Solder Re-flow :
Recommended temperature profiles for lead free re-flow soldering in Figure 1. (Refered to J-STD-020C)
8-2.2 Soldering Iron :
Products attachment with a soldering iron is discouraged due to the inherent process control limitations. If a
soldering iron must be employed the following precautions are recommended. for Iron Soldering in Figure 2.
Note :
a) Preheat circuit and products to 150° C.
d) 1.0mm tip diameter (max)
b) 350° C tip temperature for Ferrite chip bead (max) e) Use a 20 watt soldering iron with tip diameter of 1.0mm
c) Never contact the ceramic with the iron tip
f) Limit soldering time to 4-5 secs.
P rehe ating
TP(26 0° C/40 s max.)
S olde ring
20~40s
Natu ral
cooling
217
200
150
60~150s
60~180s
4 80s max.
25
Time(sec.)
Figure 1. Re-flow Soldering:3 times max
P rehe ating
350
S olde ring
Natu ral
cooling
150
O ve r 60s.
G rad ual
Cooling
Within4 ~5s
Figure 2. Wave Soldering:1 times max
NOTE : Specifications subject to change without notice. Please check our website for latest information.
19.01.2015
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 6