L201210_SERIES Datasheet, PDF (4/6 Pages) Superworld Electronics – FERRITE CHIP INDUCTORS

FERRITE CHIP INDUCTORS
L201210 SERIES
8. SOLDERING AND MOUNTING :
8-1. Reflow soldering conditions
Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited to 150° C max.
Also cooling into the solvent after soldering should be in such a way that the temperature difference is limited to 100° C max.
Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality.
Products should be soldered within the following allowable range indicated by the slanted line. The excessive soldering conditions
may cause the corrosion of the electrode. When soldering is repeated, allowable time is the accumulated time.
main heating
230° C
E
pre-heating
normal
temperature
A
180° C
120° C
B
C
D
TIME(sec.)
(Melting area of solder)
A Slope of temp. rise
1 to 5 ° C/sec
Heat time
B
Heat temperature
50 to 150 sec
120 to 180 ° C
C Slope of temp. rise
1 to 5 ° C/sec
D Time over 230° C
90 ~ 120 sec
Peak temperature
E
Peak hold time
No. of mounting
255 ~ 260 ° C
10 max.
3
sec
times
8-2. Soldering Iron
Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that
a soldering iron must be employed the following precautions are recommended.
Note :
a) Preheat circuit and products to 150° C.
b) 280° C tip temperature (max)
c) Use a 30 watt max. soldering iron with tip diameter of 3.0mm
d) Limit soldering time to 3 secs.
8-3. Solder Volume :
Accordingly increasing the solder volume, the mechanical stress to product is also
increased. Exceeding solder volume may cause the failure of mechanical or electrical
performance. Solder shall be used not to be exceed as shown in right side.
Upper limit
Recommendable
NOTE : Specifications subject to change without notice. Please check our website for latest information.
30.01.2015
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 4