HWI252018 Datasheet, PDF (2/6 Pages) Superworld Electronics – MOLDED WIREWOUND CHIP INDUCTORS

MOLDED WIREWOUND CHIP INDUCTORS _{HWI252018 SERIES}
5. GENERAL SPECIFICATION :
a) Temp. rise : 20°C Max.
b) Ambient temp. : 100°C Max.
c) Storage temp. : -40°C to +125°C
d) Operating temp. : -40°C to +125°C
e) Terminal strength : 0.5Kg Min.
f) Rated current : Current cause inductance drop within 10%
g) Resistance to solder heat : 260°C for 10secs
h) Resistance to solvent : Per MIL-STD-202F
6. RECOMMENDED REFLOW SOLDERING PROFILE :
Profile Feature
Preheat & Soak
Temperature min. ( T_smin )
Temperature max. ( T_smax )
Time ( T_smin to T_smax ) ( t _s )
Average ramp-up rate
( T_smax to T_p )
Liquidous temperature ( T_L)
Time at liquidous ( t _L )
Peak package body
temperature ( T_p )
Time ( t _p ) within 5°C of the
specified classification
temperature ( T_c )
Average ramp-down rate
( T_p to T_smax )
Time 25°C to peak
temperature
Sn-Pb Eutectic Assembly
100°C
150°C
60~120 seconds
3°C/second max.
183°C
60~150 seconds
230°C
10 seconds max
6°C/second max.
6 minutes max.
Pb-Free Assembly
150°C
200°C
60~120 seconds
3°C/second max.
217°C
60~150 seconds
250°C
10 seconds max
6°C/second max.
8 minutes max.
NOTE : Specifications subject to change without notice. Please check our website for latest information.
10.03.2011
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 2