MMBZ5221B Datasheet, PDF (1/2 Pages) Pan Jit International Inc. – SURFACE MOUNT SILICON ZENER DIODES

MMBZ5221B - MMBZ5259B
300 MW Surface Mount Zener Diodes
Features
z Planar Die Construction
z 300 mW Power Dissipation on FR-4 PCB
z General Purpose, Medium Current
A
z Ideally Suited for Automated Assembly Process
BC
Mechanical Data
E
D
G
z Case: SOT-23, Molded Plastic
H
z Terminals: Solderable per MIL-STD-202,
Method 208
z Polarity: See Diagrams
K
M
J
L
z Weight: 0.008 grams (approx.)
z Marking : Marking Code (See Table On Page 2)
SOT-23
Dim Min Max
A
0.37 0.51
B
1.20 1.40
C
2.30 2.50
D
0.89 1.03
E
0.45 0.60
G
1.78 2.05
H
2.80 3.00
J 0.013 0.10
K 0.903 1.10
L
0.45 0.61
M 0.085 0.180
a
0°
8°
All Dimensions in mm
Maximum Ratings ^{@ T}A ^{= 25°C unless otherwise specified}
PARAMETER
SYMBOL
VALUE
Maximum Forward Voltage Diode at I_F = 100 mA
V_F
1.0
Maximum Power Dissipation (Notes 1) at 25°C
P_D
300
Peak Forward Surge Current, 8.3 ms single half sine-wave
superimposed on rated load (JEDEC method) (Notes 2)
I_FSM
4.0
Operating Junction and Storage Temperature Range
T_J
-55~150
1. Mounted on 5.0 mm² (.013mm thick) land areas. 2. Alumina = 0.4 X 0.3 X 0.024 in. 99.5% alumina.
2. Measured on 8.3ms, single half sine-wave or equivalent square wave, duty cycle = 4 pulses per minute maximum.
UNITS
V
mW
Amps
℃
1of2