EC11FS4 Datasheet, PDF (1/2 Pages) Nihon Inter Electronics Corporation – FRD - Low Forward Voltage Drop

VOLTAGE RANGE: 400V
CURRENT: 1.0 A
Features
! Miniature Size,Surface Mount Device
! Low Forward Voltage Drop
! ^{High Surge Capability}
! Low Power Loss,High Efficiency
! ^{Ultra-Fast Recovery}
! Packaged in 12mm Tape and Reel
! _{Not Rolling During Assembly}
Mechanical Data
! Case: SMB/DO-214AA, Molded Plastic
! Terminals: Solder Plated, Solderable
per MIL-STD-750, Method 2026
! Polarity: Cathode Band or Cathode Notch
! ^{Marking: Type Number}
! Weight: 0.093 grams (approx.)
EC11FS4
SURFACE MOUNT SUPER FAST RECOVERY RECTIFIER DIODES
B
SMB(DO-214AA)
Dim Min Max
A
3.30 3.94
A
C
B
4.06 4.70
C
1.91 2.21
D
0.15 0.31
D
E
5.00 5.59
G
0.10 0.20
J
H
0.76 1.52
H
G
E
J
2.00 2.62
All Dimensions in mm
Maximum Ratings @ T_A = 25°C unless otherwise specified
Characteristic
Symbol EC11FS4
Unit
RepetitivePeak Reverse Voltage
VRRM
400
V
Non-repetitive Peak Reverse Voltage
VRSM
440
V
0.76
Average Rectified Forward Current 50Hz Half Sine Wave Resistive Load
IO
1.0
A
R.M.S.Forward Current
IF(RMS)
1.57
A
Surge Forward Current 50Hz Half Sine Wave,Icycle,Non-repetitive
IFSM
20
A
Operating Junction Temperature Range
Storage Temperature Range
Tjw
-40 to +150
°C
Tstg
-40 to +150
°C
Characteristic
Peak Reverse Current Tj= 25 °C, V RM = V RRM
Peak Forward Voltage Tj= 25 °C, I FM = 0.8A
Reverse Recovery Time I FM = 1A, -di/dt= 50A/ s, Ta = 2 5 ° C
Thermal Resistance
Junction to Ambient ^*1
*2
1 Glass Epoxy Substrate Mounted (Soldering Lands=2x2mm,Both Sides)
2 Alumina Substrate Mounted (Soldering Lands=2x2mm,Both Sides)
Symbol
IRM
VFM
trr
Rth(j-a)
M in.
-
-
-
-
-
Typ.
-
-
-
-
-
Max.
20
1 .25
30
157
108
Unit
µA
V
ns
°C /W
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