BY228GP Datasheet, PDF (1/2 Pages) Gulf Semiconductor – SINTERED GLASS JUNCTION PLASTIC RECTIFIER VOLTAGE:1500V CURRENT: 3.0A

BY228GP
3.0A Axial Leaded Sintered Class Junction Plastic Rectifier
Features
· _{High temperature metallurgically bonded construction}
· Sintered glass cavity free junction
· Capability of meeting environmental standard of
MIL-S-19500
· _{High temperature soldering guaranteed}
350°C /10sec/0.375”lead length at 5 lbs tension
· Operate at Ta =55°C with no thermal run away
· Typical Ir<0.1µA
Mechanical Data
· _{Terminal:Plated axial leads solderable per}
MIL-STD 202E, method 208C
· _{Case:Molded with UL-94 Class V-0 recognized Flame}
Retardant Epoxy
· Polarity:color band denotes cathode
· Mounting position:any
A
B
A
D
DO-201AD
Dim
Min
Max
A
25.40
¾
B
7.20
9.50
C
1.20
1.30
D
4.80
5.30
All Dimensions in mm
Maximum Ratings and Electrical Characteristics ^{@ TA = 25°C unless otherwise specified}
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Maximum Recurrent Peak Reverse Voltage
Maximum RMS Voltage
Maximum DC blocking Voltage
Maximum Average Forward Rectified
Current 3/8”lead length at Ta =55°C
Peak Forward Surge Current 8.3ms single
Half sine-wave superimposed on rated load
Maximum Instantaneous Forward Voltage
At 5.0A
Maximum full load reverse current full cycle
Average at 55°C
Maximum DC Reverse Current
at rated DC blocking voltage
Typical Reverse Recovery Time
Ta =25°C
Ta =150°C
(Note 1)
Typical Thermal Resistance
(Note 2)
Storage and Operating Junction Temperature
SYMBOL
Vrrm
Vrms
Vdc
If(av)
Ifsm
Vf
Ir(av)
Ir
Trr
Rth(ja)
Tstg, Tj
BY228GP
1500
1050
1500
3.0
125.0
1.50
100.0
5.0
100.0
1000
70.0
-65 to +175
Note:
1. Reverse Recovery Condition If =0.5A, Ir =1.0A, Irr =0.25A
2. Thermal Resistance from Junction to Ambient on PC board with spacing 25mm
C
units
V
V
V
A
A
V
µA
µA
µA
nS
K /W
°C
1 of 2