STM8S103F3P6TR Datasheet, PDF (93/113 Pages) STMicroelectronics – Access line, 16 MHz STM8S 8-bit MCU, up to 8 Kbytes Flash

STM8S103K3 STM8S103F3 STM8S103F2
Package information
11.2
32-lead UFQFPN package mechanical data
Figure 46: 32-lead, ultra thin, fine pitch quad flat no-lead package (5 x 5)
AOB8_ME
1. Drawing is not to scale.
2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint
life.
3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended
to connect and solder this backside pad to PCB ground.
4. Dimensions are in millimeters.
Table 53: 32-lead, ultra thin, fine pitch quad flat no-lead package mechanical data
Dim.
mm
inches⁽¹⁾
Min
Typ
Max
Min
Typ
Max
A
0.500
0.550
0.600
0.0197
0.0217 0.0236
A1
0
0.020
0.050
0.0008 0.0020
A3
0.200
0.0079
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