STM32L151VBT6 Datasheet, PDF (91/121 Pages) STMicroelectronics – Ultra-low-power 32-bit MCU ARM-based Cortex-M3, 128KB Flash, 16KB SRAM, 4KB EEPROM, LCD, USB, ADC, DAC

STM32L151x6/8/B, STM32L152x6/8/B
Electrical characteristics
Table 54. ADC characteristics (continued)
Symbol
Parameter
Conditions
Min Typ Max Unit
t_S
Sampling time
t_CONV
Total conversion time
(including sampling time)
Direct channels
0.25
2.4 V ≤ V_DDA ≤ 3.6 V
Multiplexed channels
0.56
2.4 V ≤ V_DDA ≤ 3.6 V
Direct channels
0.56
1.8 V ≤ V_DDA ≤ 2.4 V
Multiplexed channels
1
1.8 V ≤ V_DDA ≤ 2.4 V
4
384
f_ADC = 16 MHz
1
24.75
4 to 384 (sampling
phase) +12 (successive
approximation)
µs
1/f_ADC
µs
1/f_ADC
C_ADC
Internal sample and hold
capacitor
Direct channels
Multiplexed channels
16
pF
f_TRIG
f_TRIG
R_AIN
t_lat
t_latr
t_STAB
External trigger frequency
Regular sequencer
12-bit conversions
6/8/10-bit conversions
External trigger frequency
Injected sequencer
12-bit conversions
6/8/10-bit conversions
External input impedance
Injection trigger conversion
f_ADC = 16 MHz
219
latency
3.5
Regular trigger conversion
f_ADC = 16 MHz
156
latency
2.5
Power-up time
Tconv+1 1/f_ADC
Tconv 1/f_ADC
Tconv+2 1/f_ADC
Tconv+1 1/f_ADC
50
kΩ
281
ns
4.5 1/f_ADC
219
ns
3.5 1/f_ADC
3.5
µs
1. The Vref+ input can be grounded iif neither the ADC nor the DAC are used (this allows to shut down an
external voltage reference).
2. The current consumption through VREF is composed of two parameters:
- one constant (max 300 µA)
- one variable (max 400 µA), only during sampling time + 2 first conversion pulses.
So, peak consumption is 300+400 = 700 µA and average consumption is 300 + [(4 sampling + 2) /16] x
400 = 450 µA at 1Msps
3. V_REF+ can be internally connected to V_DDA and V_REF- can be internally connected to V_SSA, depending on
the package. Refer to Section 4: Pin descriptions for further details.
4. V_SSA or V_REF- must be tied to ground.
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