SPT02-236DDB Datasheet, PDF (9/12 Pages) STMicroelectronics – Automation sensor transient and overvoltage protection

SPT02-236DDB
Recommendation on PCB assembly
7
Recommendation on PCB assembly
7.1
Stencil opening design
1. General recommendation on stencil opening design
a) Stencil opening dimensions: L (Length), W (Width), T (Thickness).
Figure 10. Stencil opening dimensions
L
TW
b) General design rule
Stencil thickness (T) = 75 ~ 125 µm
Aspect Ratio
=
W-----
T
≥
1,5
Aspect Area = _2----T---L-(---L-^×----+-W----W------₎ ≥ 0,66
2. Reference design
a) Stencil opening thickness: 100 µm
b) Stencil opening for central exposed pad: Opening to footprint ratio is 50%.
c) Stencil opening for leads: Opening to footprint ratio is 90%.
7.2
Solder paste
1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004.
2. “No clean” solder paste is recommended.
3. Offers a high tack force to resist component movement during high speed.
4. Solder paste with fine particles: powder particle size is 20-45 µm.
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