EMIF08-1005M16 Datasheet, PDF (9/10 Pages) STMicroelectronics – 8-line IPAD™ low capacitance EMI filter and ESD protection in micro QFN package

EMIF08-1005M16
Ordering information
4.5
Reflow profile
Figure 14. ST ECOPACK® recommended soldering reflow profile for PCB mounting
Temperature (°C)
260°C max
255°C
220°C
180°C
125 °C
3°C/s max
3°C/s max
2°C/s62r°°eCCc//ossm6mr°emCacx/eosnmmdmeadxended
0
0
1
2
3
4
5
6
7
10-30 sec
Time (min)
90 to 150 sec
90 sec max
Note:
Minimize air convection currents in the reflow oven to avoid component movement.
5
Ordering information
Table 4. Ordering information
Part number
Marking Package
Weight
EMIF08-1005M16
H8⁽¹⁾
Micro QFN
7.2 mg
1. The marking can be rotated by 90° to differentiate assembly location
Base qty
3000
Delivery mode
Tape and reel (7”)
6
Revision history
Table 5. Document revision history
Date
Revision
Changes
24-Oct-2006
1
Initial release.
04-Feb-2008
2
Reformatted to current standards. Updated ECOPACK statement.
Added Section 4: Recommendation on PCB assembly.
9/10