|
STM32F103C4T6A Datasheet, PDF (83/90 Pages) STMicroelectronics – Low-density performance line, ARM-based 32-bit MCU | |||
|
◁ |
STM32F103x4, STM32F103x6
Package characteristics
6.2
6.2.1
Thermal characteristics
The maximum chip junction temperature (TJmax) must never exceed the values given in
Table 9: General operating conditions on page 32.
The maximum chip-junction temperature, TJ max, in degrees Celsius, may be calculated
using the following equation:
TJ max = TA max + (PD max à ÎJA)
Where:
â TA max is the maximum ambient temperature in ° C,
â ÎJA is the package junction-to-ambient thermal resistance, in ° C/W,
â PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/Omax),
â PINT max is the product of IDD and VDD, expressed in Watts. This is the maximum chip
internal power.
PI/O max represents the maximum power dissipation on output pins where:
PI/O max = Σ (VOL à IOL) + Σ((VDD â VOH) à IOH),
taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the
application.
Table 56. Package thermal characteristics
Symbol
Parameter
Thermal resistance junction-ambient
TFBGA64 - 5 Ã 5 mm / 0.5 mm pitch
Thermal resistance junction-ambient
LQFP64 - 10 Ã 10 mm / 0.5 mm pitch
ÎJA
Thermal resistance junction-ambient
LQFP48 - 7 Ã 7 mm / 0.5 mm pitch
Thermal resistance junction-ambient
UFQFPN 48 -7 Ã 7 mm / 0.5 mm pitch
Thermal resistance junction-ambient
VFQFPN 36 - 6 Ã 6 mm / 0.5 mm pitch
Value
65
45
55
32
18
Unit
°C/W
Reference document
JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org.
Doc ID 15060 Rev 6
83/90
|
▷ |