STM32F103X6_08 Datasheet, PDF (80/84 Pages) STMicroelectronics – Performance line, ARM-based 32-bit MCU with Flash, USB, CAN, seven 16-bit timers, two ADCs and nine communication interfaces

Revision history
8
Revision history
STM32F103xx
Table 56. Document revision history
Date
Revision
Changes
01-jun-2007
1
Initial release.
20-Jul-2007
Flash memory size modified in Note 6, Note 4, Note 7, Note 8 and
BGA100 pins added to Table 3: Pin definitions. Figure 3:
STM32F103xx performance line BGA100 ballout added.
T_HSE changed to T_LSE in Figure 19: Low-speed external clock source
AC timing diagram. V_BAT ranged modified in Power supply schemes.
t_SU(LSE) changed to t_SU(HSE) in Table 21: HSE 4-16 MHz oscillator
characteristics. I_DD(HSI) max value added to Table 23: HSI oscillator
characteristics.
Sample size modified and machine model removed in Electrostatic
discharge (ESD).
Number of parts modified and standard reference updated in Static
latch-up. 25 °C and 85 °C conditions removed and class name modified
in Table 32: Electrical sensitivities. R_PU and R_PD min and max values
added to Table 33: I/O static characteristics. R_PU min and max values
added to Table 36: NRST pin characteristics.
2
Figure 24: I2C bus AC waveforms and measurement circuit and
Figure 23: Recommended NRST pin protection corrected.
Notes removed below Table 7, Table 36, Table 42.
I_DD typical values changed in Table 11: Maximum current consumption
in Run and Sleep modes. Table 37: TIMx characteristics modified.
t_STAB, V_REF+ value, t_lat and f_TRIG added to Table 44: ADC
characteristics.
In Table 28: Flash memory endurance and data retention, typical
endurance and data retention for T_A = 85 °C added, data retention for
T_A = 25 °C removed.
V_BG changed to V_REFINT in Table 10: Embedded internal reference
voltage. Document title changed. Controller area network (CAN)
section modified.
Figure 11: Power supply scheme modified.
Features on page 1 list optimized. Small text changes.
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