TN1163 Datasheet, PDF (8/21 Pages) STMicroelectronics – Description of WLCSP for microcontrollers and recommendations for use

Package description
TN1163
2.2
Mechanical description
An example of WLCSP outline and mechanical dimensions is given in Figure 2 and Table 2.
Die size and ball count are adapted to the connection requirements. Refer to device
datasheet for package mechanical data and outline.
The WLCSP tolerances on ball diameter and ball height are very low. This constant ball
shape insures a good coplanarity between balls. Optical measurements performed through
vertical focuses show a ball-plus-die coplanarity well below 50 μm.
Figure 2. Matrix 8 x 8 bump array WLCSP
#
E
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D
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Table 2. Matrix 8 x 8 bump dimension WLCSP
Symbol
Typical (mm)
A
0.585
A2
0.230
C
3.500
D
0.320
E
3.500
e1
0.500
d1
0.483
d2
0.448
Typical device marking for the flat backside of the die is shown on Figure 3.
WLCSP ball 1 is identified by the A1 pin marked on the flat backside of the die so that the
orientation of the component can be easily determined before and after assembly. This dot
has been designed so that it can be detected by standard vision systems.
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