TDA7296S Datasheet, PDF (8/11 Pages) STMicroelectronics – 60V - 60W DMOS AUDIO AMPLIFIER WITH MUTE/ST-BY

TDA7296S
APPLICATION NOTE: (ref. fig. 7)
Modular Application (more Devices in Parallel)
The use of the modular application lets very high
power be delivered to very low impedance loads.
The modular application implies one device to act
as a master and the others as slaves.
The slave power stages are driven by the master
device and work in parallel all together, while the
input and the gain stages of the slave device are
disabled, the figure below shows the connections
required to configure two devices to work to-
gether.
The master chip connections are the same as
the normal single ones.
The outputs can be connected together with-
out the need of any ballast resistance.
Figure 6: Modular Application Circuit
The slave SGND pin must be tied to the nega-
tive supply.
The slave ST-BY pin must be connected to
ST-BY pin.
The bootstrap lines must be connected to-
gether and the bootstrap capacitor must be in-
creased: for N devices the boostrap capacitor
must be 22µF times N.
The slave Mute and IN-pins must be grounded.
THE BOOTSTRAP CAPACITOR
For compatibility purpose with the previous de-
vices of the family, the boostrap capacitor can be
connected both between the bootstrap pin (6) and
the output pin (14) or between the boostrap pin
(6) and the bootstrap loader pin (12).
MASTER
VMUTE
VSTBY
SLAVE
8/11
R3 22K
C7 100nF
+Vs C6 1000µF
C2
22µF
R2
680Ω
IN- 2
C1 470nF
IN+ 3
R1 22K
SGND 4
R5 10K
MUTE 10
R4 22K
STBY 9
C4 10µF
C3 10µF
+Vs
-
+
MUTE
STBY
1
STBY-GND
C7 100nF
BUFFER
DRIVER
7
11
+PWVs
13
THERMAL
SHUTDOWN
8
-Vs
S/C
PROTECTION
15
-PWVs
14 OUT
C10
BOOT
100nF
12 _LOADER
R7
2Ω
C5
6
47µF
BOOTSTRAP
5
CLIP DET
C9 100nF
C8 1000µF
-Vs
+Vs
C6 1000µF
IN- 2
IN+ 3
SGND 4
MUTE 10
9
STBY
+Vs
-
BUFFER
DRIVER
7
11
+
+PWVs
13
14 OUT
BOOT
12 _LOADER
MUTE
STBY
1
STBY-GND
THERMAL
SHUTDOWN
8
-Vs
S/C
PROTECTION
15
-PWVs
6
BOOTSTRAP
5
C9 100nF
-Vs
C8 1000µF
D97AU808C