ESDLIN03-1BWY Datasheet, PDF (8/10 Pages) STMicroelectronics – Automotive single-line Transil

Package information
ESDLIN03-1BWY
2.2
PCB design preference
1. To control the solder paste amount, the closed via is recommended instead of open
vias.
2. The position of tracks and open vias in the solder area should be well balanced. The
symmetrical layout is recommended, in case any tilt phenomena caused by
asymmetrical solder paste amount due to the solder flow away.
2.3
Reflow profile
Figure 15. ST ECOPACK® recommended soldering reflow profile for PCB mounting
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Minimize air convection currents in the reflow oven to avoid component movement.
Maximum soldering profile corresponds to the latest IPC/JEDEC J-STD-020.
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