ESDAXLC6-1BT2 Datasheet, PDF (8/10 Pages) STMicroelectronics – Single-line bidirectional ESD protection for high speed interface

Recommendation on PCB assembly
ESDAXLC6-1BT2
3.5
Reflow profile
Figure 14. ST ECOPACK^® recommended soldering reflow profile for PCB mounting
Temperature (°C)
250
200
150
100
0.9 °C/s
50
0
30
60
90
240-245 °C
2 - 3 °C/s
60 sec
(90 max)
-2 °C/s
-3 °C/s
-6 °C/s
Time (s)
120 150 180 210 240 270 300
Note:
Minimize air convection currents in the reflow oven to avoid component movement.
Maximum soldering profile corresponds to the latest IPC/JEDEC J-STD-020.
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