STW5095_07 Datasheet, PDF (71/73 Pages) STMicroelectronics – Low-power asynchronous stereo audio Codec with integrated power amplifiers

Package outline
19 Package outline
STw5095
Table 29. Package dimensions (mm)
Ref.
Min.
Typ.
Max.
Outline and mechanical data
A ⁽¹⁾
1.010
1.200 ⁽²⁾
A1
0.150
A2
0.820
b
0.250
0.300
0.350
D
4.850
5.000
5.150
D1
3.500
E
4.850
5.000
5.150
E1
3.500
e
0.450
0.500
0.550
f
0.600
0.750
0.900
ddd
0.080
TFBGA 5x5x1.20 64 F8x8 0.50
Thin Profile Fine Pitch Ball Grid Array
1. The total profile height is measured from the seating plane to the top of the component.
2. Max mounted height is 1.12mm.Based on a 0.28mm ball pad diameter. Solder paste is 0.15mm thickness and 0.28mm
diameter.
Figure 33. Package mechanical data
D
D1
e
f
SEATING
PLANE
C
A2
H
G
F
E
D
C
B
A
12345678
A1 CORNER INDEX AREA Øb (64 BALLS)
See Note 1
A1
A
ddd ^C
BOTTOM VIEW
Note: 1 The terminal A1 corner must be identified on the top surface by using a corner chamfer, ink
or metallized markings, or other feature of package body or integral heatslug. A
distinguishing feature is allowable on the bottom surface of the package to identify the
terminal A1 corner. Exact shape of each corner is optional.
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