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| ESDAXLC6-1BU2 Datasheet, PDF (7/10 Pages) STMicroelectronics – Single-line bidirectional ESD protection for high speed interface | |||
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ESDAXLC6-1BU2
Recommendation on PCB assembly
4
Recommendation on PCB assembly
4.1
Stencil opening design
Figure 12. Recommended stencil windows position
0.425
1.05
0.425
0.225
0.30
0.040
0.065 0.20
Footprint
0.038
0.320 0.038
Stencil window
4.2
Solder paste
1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004.
2. âNo cleanâ solder paste is recommended.
3. Offers a high tack force to resist component movement during high speed
4. Solder paste with fine particles: powder particle size is 20-45 µm.
Doc ID 023702 Rev 1
7/10
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