EMIF09-SD01F3 Datasheet, PDF (7/8 Pages) STMicroelectronics – 9 line EMI filter and ESD protection

EMIF09-SD01F3
4 Ordering information
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect . The category of
second level interconnect is marked on the inner box label, in compliance with JEDEC
Standard JESD97. The maximum ratings related to soldering conditions are also marked on
the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at:
www.st.com.
4 Ordering information
Part Number
EMIF09-SD01F3
Marking
GZ
Package
Flip-Chip
Weight
5.2 mg
Base qty Delivery mode
5000 Tape and reel (7”)
Note:
More information is available in the application note :
AN1235 :"Flip Chip : Package description and recommendations for use"
AN1751 : EMI Filters: Recommendations and measurements
5 Revision history
Date
19-Oct-2005
09-Feb-2006
Revision
Changes
1
Initial release.
2
Tape cavity dimensions added in Figure 13. Other graphics improved.
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