EMIF06-10006C2 Datasheet, PDF (7/9 Pages) STMicroelectronics – 6 line EMI filter and ESD protection

EMIF06-10006C2
Figure 14. Flip-Chip Tape and reel specification
Dot identifying Pin A1 location
4 +/- 0.1
Package information
Ø 1.5 +/- 0.1
Note:
0.73 +/- 0.05
4 +/- 0.1
All dimensions in mm
User direction of unreeling
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Note: More packing information is available in the application notes:
AN1235: “Flip-Chip: Package description and recommendations for use”
AN1751: "EMI Filters: Recommendations and measurements"
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