EVAL6470H Datasheet, PDF (65/70 Pages) STMicroelectronics – dSPIN fully integrated microstepping motor driver with motion engine and SPI

L6470
10 Package mechanical data
Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK^® packages, depending on their level of environmental compliance. ECOPACK^®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK^® is an ST trademark.
Table 57. HTSSOP28 mechanical data
Dim.
Min.
mm
Typ.
Max.
A
A1
A2
b
c
D ⁽¹⁾
D1
E
E1 ⁽²⁾
E2
e
L
L1
K
aaa
1.2
0.15
0.8
1.0
1.05
0.19
0.3
0.09
0.2
9.6
9.7
9.8
5.5
6.2
6.4
6.6
4.3
4.4
4.5
2.8
0.65
0.45
0.6
0.75
1.0
0°
8°
0.1
1. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs
must not exceed 0.15 mm per side.
2. Dimension “E1” does not include interlead flash or protrusions. Interlead flash or protrusions must not
exceed 0.25 mm per side.
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