Z0409MF-1AA2 Datasheet, PDF (6/8 Pages) STMicroelectronics – Different gate current sensitivities are available, allowing optimized performances when controlled directly from microcontrollers.

Package information
Z04
3
Package information
DIMENSIONS
REF.
Millimeters
Inches
Min. Typ. Max. Min. Typ. Max.
A
10.1
0.398
A
C
7.3
0.287
D
C
F
O
H
FD ^J
J
P
H
M
N1
N
N
M
N1
O
10.5
1.5
0.51
1.5
4.5
5.3
2.54
1.4
0.413
0.059
0.020
0.059
0.177
0.209
0.100
0.055
P
0.7
0.028
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
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