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TDA7497SA Datasheet, PDF (6/10 Pages) STMicroelectronics – 8W+8W+15W TRIPLE AMPLIFIER | |||
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TDA7497SA
3 HEAT SINK DIMENSIONING:
In order to avoid the thermal protection intervention, that is placed approximatively at Tj = 150°C, it is important
the dimensioning of the Heat Sinker RTh (°C/W).
The parameters that influence the dimensioning are:
â Maximum dissipated power for the device (Pdmax)
â Max thermal resistance Junction to case (RTh j-c)
â Max. ambient temperature Tamb max
â Quiescent current Iq (mA)
3.1 Example:
VCC = 28V, Rload = 8ohm (left/right), Rload = 4ohm (centre), RTh j-c = 2.5°C/W , Tamb max = 50°C
Pdmax
=
(N°
channels)
·
----------V----c---c--2-----------
2Î 2 â
Rload
+
Iq
â
Vcc
Pdmax = 2 · ( 3.95 ) + 1 · ( 7.9 ) + 1.2 = 17W
(Heat Sinker)
RTh c-a
=
1----5---0-----â-----T---a---m-----b----m----a---x-
Pd max
â
RTh
j-c
=
1----5---0-----â----5----0--
17
â
2.5
=
3.3 ° C /W
In figure 6 is shown the Power derating curve for the device.
Figure 11. Power Derating Curve
35
30
25
20
15
10
5
0
0
(a)
(c)
(b)
(d)
a) Infinite Heatsink
b) 1.5 °C/ W
c) 3.0 °C/ W
d) 5.0 °C/ W
40
80
120
160
Tamb (°C)
6/10
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