ITAXXB3 Datasheet, PDF (6/8 Pages) STMicroelectronics – Bidirectional Transil array for data line protection

Package information
4
Package information
ITAxxB3
● Epoxy meets UL94, V0
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Table 4. SO-20 dimensions
D
A
K
B
e
A1
L
EH
Dimensions
Ref.
Millimeters
Inches
Min. Typ. Max. Min. Typ. Max.
hx45°
A 2.35
A1 0.10
2.65 0.092
0.30 0.004
0.104
0.008
C B 0.33
0.51 0.013
0.020
C 0.23
0.32 0.009
0.013
D 12.6
13.0 0.484
0.512
E 7.40
7.60 0.291
0.299
e
1.27
0.050
H 10.0
10.65 0.394
0.419
h 0.25
0.75 0.010
0.029
L 0.40
1.27 0.016
0.050
K
8° (max)
Figure 11. SO-20 footprint (dimensions in mm)
8.5
11.2
1.27
0.6
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