ESDCAN0X-2BWY Datasheet, PDF (6/8 Pages) STMicroelectronics – Dual-line ESD and EOS protection

ESDCAN0x-2BWY
3
Recommendation on PCB assembly
3.1
PCB design preference
1. To control the solder paste amount, the closed via is recommended instead of open
vias.
2. The position of tracks and open vias in the solder area should be well balanced. A
symmetrical layout is recommended, to avoid any tilt phenomena caused by
asymmetrical solder paste due to solder flow away.
3.2
Reflow profile
Figure 5: ST ECOPACK^® recommended soldering reflow profile for PCB mounting
Minimize air convection currents in the reflow oven to avoid component
movement. Maximum soldering profile corresponds to the latest IPC/JEDEC J-
STD-020.
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DocID027651 Rev 4