ESDAULC6-8F3 Datasheet, PDF (6/8 Pages) STMicroelectronics – 8-line ultralarge bandwidth ESD protection

Package information
Figure 14. Footprint
Copper pad diameter:
220 µm recommended, 260 µm max
Solder mask opening:
300 µm minimum
Solder stencil opening:
220 µm recommended
Figure 15. Marking
Dot, ST logo
ECOPACK ^® Grade
xx = maring
z = manufacturing location
yww = datecode
(y = year
ww = week)
ESDAULC6-8F3
xxz
y _ww
Figure 16. Flip Chip tape and reel specification
Dot identifyng Pin A1 location
4.0 ± 0.1
Ø 1.5 ± 0.1
Note:
0.69 ± 0.05
1.30
4.0 ± 0.1
All dimensions in mm
User direction of unreeling
More packing information is available in the application notes:
AN2348: "Flip Chip: Package description and recommendations for use"
AN1751: "EMI Filters: Recommendations and measurements"
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Doc ID 16859 Rev 2