145 Datasheet, PDF (6/12 Pages) STMicroelectronics – PRODUCT/PROCESS CHANGE NOTIFICATION

Process Change/ Transfer
Qualification report n° QASO8N91
2. QUALIFICATION PLAN
2.1 PROCESS QUALIFICATION REQUIREMENTS
2.1.1 Flow Chart comparison (1)
2.1.2 Control Plan comparison (1)
2.1.3 FMEA study (1)
2.1.4 Process construction analysis (1)
2.1.5 Quantity of qualification lots
[ ]1
2.1.6 Critical parametric parameters analysis (Cpk)
Bond pull test, Bond shear test.
2.1.7 Non critical parameters analysis (Mean)
Note 1: as described in related ADCS procedure
yes [ X ]
no [ ]
yes [ X ]
no [ ]
yes [ X ]
no [ ]
yes [ X ]
no [ ]
[ ]2 [X ]3
yes [X ]
no [ ]
N/A [ ]
N/A [ ]
N/A [ ]
N/A [ ]
[ ]4
N/A [ ]
yes [X ]
no [ ]
N/A [ ]
2.2 Test Vehicles (TV) description.
Line
0431*
0158*
0082*
Sales Type
TL431CD
LM358D
TL082CD
P&L
71
71
71
Dice size
1.38x1.12mm
1.07x 1.01
1.74x1.48
* shrinked die version
Package
SO8
SO8
SO8
Assy
ST Muar
ST Muar
ST Muar
Reliab plant
Grenoble +Muar
Grenoble
Muar
Lot #
1
1
1
2.3 FINAL TEST QUALIFICATION REQUIREMENTS
[ x ] yes
[ ] no
2.3.1 Quantity of qualification lots
2.3.2 Lot average yield data:
2.3.3 Package type
2.3.4 Parameter distributions
2.3.4.1List of parameters:
2.3.4.2 Qualification criteria: N/A
[]1
[]1
SO8
[X ] N/A
[X ] 2
[]3
[X ]2
[]3
[ ] LotA [ ] LotB
[ ] Lot C
2.4 BENCH MEASUREMENTS QUALIFICATION REQUIREMENTS
[ X] yes
[ ] no [ ]N/A
Construction analysis conforms to ST specification.
2.5 SPECIFIC TESTS QUALIFICATION REQUIREMENTS [] yes [ ] no [x] N/A
2.5.1 ESD
2.5.1 Latch-up
[] yes
[] yes
[ x ] no
[ x ] no
Prepared by JM Bugnard
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