STM32F098CC Datasheet, PDF (55/128 Pages) STMicroelectronics – Reset and power management

STM32F098CC STM32F098RC STM32F098VC
Electrical characteristics
6.3
Operating conditions
6.3.1 General operating conditions
Table 23. General operating conditions
Symbol
Parameter
Conditions
Min
Max
Unit
f_HCLK
f_PCLK
V_DD
V_DDIO2
Internal AHB clock frequency
Internal APB clock frequency
Standard operating voltage
I/O supply voltage
-
-
-
Must not be supplied if V_DD
is not present
0
0
1.65
1.65
48
48
1.95
3.6
MHz
V
V
V_DDA
Analog operating voltage
(ADC and DAC not used)
Analog operating voltage
(ADC and DAC used)
Must have a potential equal
V_DD
to or higher than V_DD
2.4
3.6
3.6
V
V_BAT
V_IN
Backup operating voltage
I/O input voltage
-
TC and RST I/O
TTa and POR I/O
FT and FTf I/O
1.65
3.6
V
–0.3 V_DDIOx+0.3
–0.3 V_DDA+0.3⁽¹⁾
V
–0.3
5.2⁽¹⁾
UFBGA100
-
364
LQFP100
-
476
Power dissipation at T_A = 85 °C ^LQFP64
P_D
for suffix 6suofrfiTx_A7=(2)105 °C for
WLCSP64
UFBGA64
-
455
-
377
mW
-
308
LQFP48
-
370
UFQFPN48
-
625
Ambient temperature for the
Maximum power dissipation –40
85
suffix 6 version
Low power dissipation⁽³⁾
–40
105
°C
TA
Ambient temperature for the
Maximum power dissipation –40
105
suffix 7 version
Low power dissipation⁽³⁾
–40
125
°C
1. For operation with a voltage higher than V_DDIOx + 0.3 V, the internal pull-up resistor must be disabled.
2. If T_A is lower, higher P_D values are allowed as long as T_J does not exceed T_Jmax. See
3.
In low power dissipation state,
Thermal characteristics).
T_A
can
be
extended
to
this
range
as
long
as
T_J
does
not
exceed
T_Jmax
(see
Section
7.8:
6.3.2
Operating conditions at power-up / power-down
The parameters given in Table 24 are derived from tests performed under the ambient
temperature condition summarized in Table 23.
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