STMPE821 Datasheet, PDF (50/55 Pages) STMicroelectronics – 8-bit Xpander Logic™ with touchkey controller

Package mechanical data
13 Package mechanical data
STMPE821
In order to meet environmental requirements, ST offers these devices in ECOPACK^®
packages. These packages have a Lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Figure 13. QFN16L (2.6 x 1.8 mm) package outline
BOTTOM VIEW
QFN16L
1. Drawing not to scale.
2. Dimensions are in millimeters.
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