ULN2065B Datasheet, PDF (5/7 Pages) STMicroelectronics – 80 V - 1.5 A QUAD DARLINGTON SWITCHES

ULN2065B-ULN2067B-ULN2069B-ULN2071B-ULN2075B-ULN2077B
MOUNTING INSTRUCTIONS
The Rth j-amb can be reduced by soldering the GND
pins to a suitable copper area of the printed circuit
board (Fig. 12) or to an external heatsink (Fig. 13).
The diagram of figure 14 shows the maximum dis-
sipable power Ptot and the Rth j-amb as a function of
the side "∝" of two equal square copper areas hav-
ing a thickness of 35 µ (1.4 mils).
Figure 12 : Example of P.C. Board Area which is
Used as Heatsink.
During soldering the pins temperature must not ex-
ceed 260 °C and the soldering time must not be
longer than 12 seconds.
The external heatsink or printed circuit copper area
must be connected to electrical ground.
Figure 13 : External Heatsink Mounting Example.
Figure 14 : Maximum Dissipable Power and Junc-
tion to Ambient Thermal Resistance
vs. Side "I".
Figure 15 : Maximum Allowable Power Dissipa-
tion vs. Ambient Temperature.
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