TDA7519 Datasheet, PDF (5/7 Pages) STMicroelectronics – MULTICHIP MODULE FOR CAR-RADIO APPLICATIONS

TDA7519
3
Package information
Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 2. LQFP44 (10x10) Mechanical data and package dimensions.
DIM.
MIN.
mm
TYP. MAX. MIN.
inch
TYP. MAX.
A
1.60
0.063
A1 0.05
0.15 0.002
0.006
A2 1.35 1.40 1.45 0.053 0.055 0.057
B 0.30 0.37 0.45 0.012 0.015 0.018
C 0.09
0.20 0.004
0.008
D 11.80 12.00 12.20 0.464 0.472 0.480
D1 9.80 10.00 10.20 0.386 0.394 0.401
D3
8.00
0.315
E 11.80 12.00 12.20 0.464 0.472 0.480
E1 9.80 10.00 10.20 0.386 0.394 0.401
E3
8.00
0.315
e
0.80
0.031
L 0.45 0.60 0.75 0.018 0.024 0.030
L1
1.00
0.039
k
0˚(min.), 3.5˚(typ.), 7˚(max.)
ccc
0.10
0.0039
OUTLINE AND
MECHANICAL DATA
LQFP44 (10 x 10 x 1.4mm)
0076922 E
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