STTH112_07 Datasheet, PDF (5/7 Pages) STMicroelectronics – High voltage ultrafast rectifier

STTH112
Package mechanical data
Table 6. SMB dimensions
Ref.
E1
D
A1
A2
b
E
c
A1
D
C
A2
E
L
b
E1
L
Figure 9. Footprint (dimensions in mm)
Dimensions
Millimeters
Inches
Min.
1.90
0.05
1.95
0.15
3.30
5.10
4.05
0.75
Max.
2.45
0.20
2.20
0.40
3.95
5.60
4.60
1.50
Min.
0.075
0.002
0.077
0.006
0.130
0.201
0.159
0.030
Max.
0.096
0.008
0.087
0.016
0.156
0.220
0.181
0.059
1.62 2.60 1.62
2.18
5.84
Table 7. DO-41 dimensions
DIMENSIONS
REF.
Millimeters
Inches
ØD
C
A
ØB
ØD
C
Min. Max. Min. Max.
A
4.07 5.20 0.160 0.205
B
2.04 2.71 0.080 0.107
C
28
1.102
D
0.712 0.863 0.028 0.034
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
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