SMC30J10A Datasheet, PDF (5/10 Pages) STMicroelectronics – 3000 W Transil™

SMC30J
Characteristics
Figure 9. Relative variation of thermal
impedance, junction to ambient,
versus pulse duration
1.00 ^{Zth(j-a)/Rth(j-a)}
Recommended pad layout
0.10 _{Single pulse}
0.01
1.E-03
epoxy printed board, FR4 copper thickness = 35 µm
1.E-02
1.E-01
1.E+00
1.E+01
t_p(s)
1.E+02 1.E+03
Figure 10. Thermal resistance junction to
ambient versus copper surface
under each lead
100 ^{Rth(j-a)(°C/W)}
epoxy printed board, FR4 copper thickness = 35 µm
90
80
70
60
50
40
30
20
10
0
S_Cu(cm²)
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Figure 11. Leakage current versus junction temperature (typical values)
1.E+05 ^IR(nA)
V_R = V_RM
1.E+04
V_RM < 10 V
1.E+03
1.E+02
1.E+01
1.E+00
25
V_RM ≥ 10 V
50
75
100
T_j(°C)
125
150
Doc ID 022064 Rev 1
5/10