SM30T28CAY Datasheet, PDF (5/12 Pages) STMicroelectronics – Automotive 3000 W Transil

SM30TY
Characteristics
Figure 9. Peak forward voltage drop versus
peak forward current
(typical values)
100.0 ^IFM(A)
Figure 10. Relative variation of thermal
impedance, junction to ambient, versus pulse
duration
1.00 ^{Zth(j-a)/Rth(j-a)}
Recommended pad layout
10.0
1.0
T_j = 150 °C
T_j = 25 °C
0.1
V_FM(V)
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
0.10
Single pulse
0.01
1.E-03
epoxy printed board, FR4 copper thickness = 35 µm
1.E-02
1.E-01
1.E+00
1.E+01
t_p(s)
1.E+02 1.E+03
Figure 11. Thermal resistance junction to ambient versus copper surface under each
lead
100 ^{Rth(j-a)(°C/W)}
epoxy printed board, FR4 copper thickness = 35 µm
90
80
70
60
50
40
30
20
10
0
S_Cu(cm²)
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
DocID022065 Rev 3
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